Functional
Printing Market; By Materials (Substrates, Ink, Conductors); By Technology
(Ink-jet, Screen, Gravure printing); By Displays (RFID, Displays, ISS) -
Forecast (2015 - 2020)
Browse 180 Pages and an in-depth TOC on "Functional Printing Market" http://industryarc.com/Report/1274/Functional-Printing-Market-analysis-report.html
The printed
electronics is mainly related with the fabrication of electronic components such as transistors, organic light emitting
diodes, photovoltaic cell and many others involving the deposition of several
materials including conductors, dielectrics and semiconductors on the
substrates. The materials can be organic or inorganic in nature. These
materials are deposited on substrates via several printing techniques including
inkjet, screen, gravure and many others to create various functional printing components. The materials involved in the
functional components impart specific functionalities such as resistivity,
conductivity control or thermo-chromic reactions, therefore designated as functional printing. As the demand for functional printing in electronics industry
accelerates, several regulation authorities are developing standards pertaining
to materials, design, process, assembly, inspection and testing of printed
electronic devices.
Institute
for Printed Circuits (IPC), association for the electronics
industries took initiative to develop the regulations for the Functional
printing industries. This initiative has already resulted in development of
operational-level printed electronics standards including Requirements for
Printed Electronics Base Materials (2012), Requirements for Printed Electronics Functional Conducive
Materials (2012) and Design Guideline for Printed Electronics (2013). IPC
has also created several standards development committees that are in the phase
of establishing standards for printed electronics. These development committees
are following:
- D-60 Printed Electronics Committee
- D-61 Printed Electronics Subcommittee
- D-62 Printed Electronics Base Material/Substrates Subcommittee
- D-63 Printed Electronics Functional Materials Subcommittee
- D-64 Printed Electronics Final Assembly Subcommittee
- D-65 Printed Electronics Test Method Development & Validation
- D-66 Printed Electronics Process Subcommittee
The collaboration of Institute for
Printed Circuits (IPC) and Japan Electronics Packaging and Circuits Association
(JPCA) is also eminent in this direction while other associations such as
National Printing Equipment Association (NPES) and Independent Electrical
Contractors, Inc. (IEC) will also be influential in creating standards
concerned with printed electronics materials, printing and converting
technologies.
As printed
electronics technology is growing rapidly, emergence of novel products in
the market will be witnessed in the coming years and it will be regulated under
certain standards depending upon their integration into different end-user
industries. The prominent example of such scenario is visible in food and
beverage industry. The involvement of functional materials in the food and
beverage packaging is subjected to several regulations including Nutrition
Labelling and Education Act of 1990 (NLEA) and the Food Safety Modernization
Act of 2010 (FSMA). The packaging materials for this industry are certified by
the U.S. Food and Drug Administration (FDA), to ensure the safety and protection
of the food that is packaged and consumed. Similar regulations will be
applicable to printed electronic devices and systems as their application base
enlarges in the future.
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